Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology

Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology

A novel system-in-package technology has been developed which enables to bury active 77 GHz chips inside a printed circuit board (PCB). The chips are connected to an RF substrate on top of the PCB using microvias. To evaluate the performance of these interconnects, silicon daisy chain chips with cop...

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Bibliographische Detailangaben
Hauptverfasser: Richter, M.D., Becker, K.F., Bottcher, L., Schneider, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Bonding
Costs
Drilling
Integrated circuit interconnections
MMICs
Printed circuits
Radio frequency
Substrates
Wire
Wiring
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Beschreibung
Zusammenfassung:A novel system-in-package technology has been developed which enables to bury active 77 GHz chips inside a printed circuit board (PCB). The chips are connected to an RF substrate on top of the PCB using microvias. To evaluate the performance of these interconnects, silicon daisy chain chips with coplanar lines are buried inside a PCB. Simulation and measurement data are compared. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.
ISSN:2167-8022
2167-8030
DOI:10.1109/GEMIC.2009.4815915