Packaging of 11 MPixel CMOS-Integrated SiGe Micro-Mirror Arrays

Packaging of 11 MPixel CMOS-Integrated SiGe Micro-Mirror Arrays

This article reports for the first time on the packaging of 10 cm 2 11 MPixel SiGe micro-mirror arrays, intended to be used as spatial light modulator (SLM). Due to very stringent requirements on mounted die flatness (

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Bibliographische Detailangaben
Hauptverfasser: Witvrouw, A., Tilmans, H.A.C., Bogaerts, L., De Moor, P., Bearda, T., Halder, S., Haspeslagh, L., Schlatmann, B., van Bommel, M., de Nooijer, C., Lauria, J., Vanneer, R., van Drieenhuizen, B.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Cleaning
Germanium silicon alloys
Optical arrays
Optical modulation
Packaging
Silicon carbide
Silicon germanium
Wafer bonding
Wafer scale integration
Wire
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Beschreibung
Zusammenfassung:This article reports for the first time on the packaging of 10 cm 2 11 MPixel SiGe micro-mirror arrays, intended to be used as spatial light modulator (SLM). Due to very stringent requirements on mounted die flatness (
ISSN:1084-6999
DOI:10.1109/MEMSYS.2009.4805337