Gate length scaling and high drive currents enabled for high performance SOI technology using high-κ/metal gate

CMOS devices with high-k/metal gate stacks have been fabricated using a gate-first process flow and conventional stressors at gate lengths of 25 nm, highlighting the scalability of this approach for high performance SOI CMOS technology. AC drive currents of 1630muA/mum and 1190muA/mum have been demo...

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Hauptverfasser: Henson, K., Bu, H., Na, M.H., Liang, Y., Kwon, U., Krishnan, S., Schaeffer, J., Jha, R., Moumen, N., Carter, R., DeWan, C., Donaton, R., Guo, D., Hargrove, M., He, W., Mo, R., Ramachandran, R., Ramani, K., Schonenberg, K., Tsang, Y., Wang, X., Gribelyuk, M., Yan, W., Shepard, J., Cartier, E., Frank, M., Harley, E., Arndt, R., Knarr, R., Bailey, T., Zhang, B., Wong, K., Graves-Abe, T., Luckowski, E., Park, D.-G., Narayanan, V., Chudzik, M., Khare, M.
Format: Tagungsbericht
Sprache:eng
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Zusammenfassung:CMOS devices with high-k/metal gate stacks have been fabricated using a gate-first process flow and conventional stressors at gate lengths of 25 nm, highlighting the scalability of this approach for high performance SOI CMOS technology. AC drive currents of 1630muA/mum and 1190muA/mum have been demonstrated in 45 nm ground-rules at 1V and 200nA/mum off current for nFETs and pFETs, at a Tinv of 14 and 15 respectively. The drive currents were achieved using a simplified high-k/metal gate integration scheme with embedded SiGe and dual stress liners (DSL) and without utilizing additional stress enhancers. Devices have been fabricated with Tinv's down to 12 and 10.5 demonstrating the scalability of this approach for 32 nm and beyond.
ISSN:0163-1918
2156-017X
DOI:10.1109/IEDM.2008.4796774