Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology

Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology

This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large p...

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Bibliographische Detailangaben
Hauptverfasser: Richter, M.D., Becker, K.-F., Bottcher, L., Schneider, M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Drilling
Germanium silicon alloys
Integrated circuit interconnections
Integrated circuit technology
Microstrip
MMICs
Radio frequency
RF signals
Silicon germanium
Voltage-controlled oscillators
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Beschreibung
Zusammenfassung:This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.
DOI:10.1109/EMICC.2008.4772350