Novel 190V LIGBT-based ESD protection for 0.35μm Smart Power technology realized on SOI substrate

A novel ESD protection implementation based on LIGBT component is presented for 0.35 mum Smart Power HV devices on SOI substrate. A Single Stage LIGBT was designed, characterized and simulated. SOA boundaries are investigated in TLP regime. ESD performances improvements achieved using LIGBT devices...

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Hauptverfasser: Gevinti, E., Cerati, L., Sambi, M., Dissegna, M., Cecchetto, L., Andreini, A., Tazzoli, A., Meneghesso, G.
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creator Gevinti, E.
Cerati, L.
Sambi, M.
Dissegna, M.
Cecchetto, L.
Andreini, A.
Tazzoli, A.
Meneghesso, G.
description A novel ESD protection implementation based on LIGBT component is presented for 0.35 mum Smart Power HV devices on SOI substrate. A Single Stage LIGBT was designed, characterized and simulated. SOA boundaries are investigated in TLP regime. ESD performances improvements achieved using LIGBT devices are highlighted and a comparison with NDRIFTMOS-based active clamps is presented.
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Clamps
CMOS technology
Electrostatic discharge
Isolation technology
Performance analysis
Protection
Semiconductor optical amplifiers
Silicon on insulator technology
Thermal conductivity
Voltage
title Novel 190V LIGBT-based ESD protection for 0.35μm Smart Power technology realized on SOI substrate
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