Reliability of the 3-D computer under stress of mechanical vibration and thermal cycling

Reliability of the 3-D computer under stress of mechanical vibration and thermal cycling

An assessment of the mechanical reliability of the 3-D Computer is presented. The purpose of this reliability assessment was to gain confidence in the feasibility of this stacked-wafer approach for space-based applications. The investigation addressed both the mechanical and thermal reliability by m...

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Bibliographische Detailangaben
Hauptverfasser: Kallis, J.M., Duncan, L.B., Laub, S.P., Little, M.J., Miani, L.M., Sandkulla, D.C.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Aircraft
Application software
Assembly
Concurrent computing
Integrated circuit interconnections
Laboratories
Microelectronics
Signal processing
Thermal stresses
Vibrations
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Zusammenfassung:An assessment of the mechanical reliability of the 3-D Computer is presented. The purpose of this reliability assessment was to gain confidence in the feasibility of this stacked-wafer approach for space-based applications. The investigation addressed both the mechanical and thermal reliability by means of analyses and experiments.< >
DOI:10.1109/WAFER.1989.47537