A clustered yield model for SMT boards and MCM's

This paper describes a clustered yield model for complex surface mount technology (SMT) assemblies and multichip modules (MCM's). Based on yield modeling techniques that have been proven in the manufacturing of integrated circuits (IC's), this model uses the negative binomial distribution...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging packaging, and manufacturing technology. Part B, Advanced packaging, 1995-11, Vol.18 (4), p.640-643
Hauptverfasser:	Tegethoff, M.M.V., Chen, T.W.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Assembly Circuit testing Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuit manufacture Integrated circuit modeling Integrated circuit testing Integrated circuit yield Integrated circuits Multichip modules Predictive models Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Surface-mount technology Virtual manufacturing
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Beschreibung
Zusammenfassung:	This paper describes a clustered yield model for complex surface mount technology (SMT) assemblies and multichip modules (MCM's). Based on yield modeling techniques that have been proven in the manufacturing of integrated circuits (IC's), this model uses the negative binomial distribution of defects to calculate board yield after test. Manufacturing data validates that this: model accurately predicts the clustering of defects and the yield predictions are significantly better than traditional binomial models.< >
ISSN:	1070-9894 1558-3686
DOI:	10.1109/96.475269