Broad area metal/metal bonding of thin film edge emitting lasers to silicon

Broad area metal/metal bonding of thin film edge emitting lasers to silicon

Thin film edge emitting lasers with top/bottom stripes are broad area metal/metal bonded to a Si substrate. The bonding and top/bottom stripes are steps forward toward better heat dissipation, current confinement, and mechanical bonding strength.

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Bibliographische Detailangaben
Hauptverfasser: Palit, S., Tsvid, G., Kirch, J., Yu-Ting Huang, J., Mawst, L., Kuech, T., Jokerst, N.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Bonding
Capacitive sensors
III-V semiconductor materials
Metallization
Optical materials
Semiconductor thin films
Silicon
Substrates
Thermal conductivity
Thin film devices
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Beschreibung
Zusammenfassung:Thin film edge emitting lasers with top/bottom stripes are broad area metal/metal bonded to a Si substrate. The bonding and top/bottom stripes are steps forward toward better heat dissipation, current confinement, and mechanical bonding strength.
ISSN:1092-8081
2766-1733
DOI:10.1109/LEOS.2008.4688519