A Multi-Aperture Image Sensor With 0.7 \mu} Pixels in 0.11 \mu} CMOS Technology

The first integrated multi-aperture image sensor is reported. It comprises a 166 \times 76 array of 16 \times 16, 0.7 \mu{\hbox{m}} pixel, FT-CCD subarrays with local readout circuit, per-column 10-bit ADCs, and control circuits. The image sensor is fabricated in a 0.11 \mu{\hbox{m}} CMOS process mo...

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Veröffentlicht in:IEEE journal of solid-state circuits 2008-12, Vol.43 (12), p.2990-3005
Hauptverfasser: Fife, Keith, El Gamal, Abbas, Wong, H.-S. Philip
Format: Artikel
Sprache:eng
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Zusammenfassung:The first integrated multi-aperture image sensor is reported. It comprises a 166 \times 76 array of 16 \times 16, 0.7 \mu{\hbox{m}} pixel, FT-CCD subarrays with local readout circuit, per-column 10-bit ADCs, and control circuits. The image sensor is fabricated in a 0.11 \mu{\hbox{m}} CMOS process modified for buried channel charge transfer. Global snap shot image acquisition with CDS is performed at up to 15 fps with 0.15 V/lux-s responsivity, 3500 e- well capacity, 5 e- read noise, 33 e-/s dark signal, 57 dB dynamic range, and 35 dB peak SNR. When coupled with local optics, the multi-aperture image sensor captures overlapping views of the scene, which can be postprocessed to obtain both a high-resolution 2-D image and a depth map. Other benefits include the ability to image objects at close proximity to the sensor without the need for objective optics, achieve nearly complete color separation through a per-aperture color filter array, relax the requirements on the camera objective optics, and increase the tolerance to defective pixels. The multi-aperture architecture is also highly scalable, making it possible to increase pixel counts well beyond current levels.
ISSN:0018-9200
1558-173X
DOI:10.1109/JSSC.2008.2006457