Consideration of thermal effects in logic simulation
This paper presents a method that considers thermal effects in logic simulations. The aim is to develop a tool that is capable of modeling the thermal behavior of a digital circuit and, at the same time, yields results almost at the speed of ordinary logic simulators. The importance of such a simula...
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| creator | Nagy, G. Horvath, G. Poppe, A. |
| description | This paper presents a method that considers thermal effects in logic simulations. The aim is to develop a tool that is capable of modeling the thermal behavior of a digital circuit and, at the same time, yields results almost at the speed of ordinary logic simulators. The importance of such a simulation is that thermal effects can be the cause of signal integrity problems. The structure and the basic operation of the simulator are discussed as well as the issues that need to be addressed throughout the development. A detailed description of the implementation of the tightly integrated thermal and logic simulation is also given. |
| doi_str_mv | 10.1109/THERMINIC.2008.4669914 |
| format | Conference Proceeding |
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The aim is to develop a tool that is capable of modeling the thermal behavior of a digital circuit and, at the same time, yields results almost at the speed of ordinary logic simulators. The importance of such a simulation is that thermal effects can be the cause of signal integrity problems. The structure and the basic operation of the simulator are discussed as well as the issues that need to be addressed throughout the development. 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The aim is to develop a tool that is capable of modeling the thermal behavior of a digital circuit and, at the same time, yields results almost at the speed of ordinary logic simulators. The importance of such a simulation is that thermal effects can be the cause of signal integrity problems. The structure and the basic operation of the simulator are discussed as well as the issues that need to be addressed throughout the development. A detailed description of the implementation of the tightly integrated thermal and logic simulation is also given.</description><subject>Circuit simulation</subject><subject>Delay estimation</subject><subject>Digital circuits</subject><subject>Digital simulation</subject><subject>Engines</subject><subject>Logic circuits</subject><subject>Logic gates</subject><subject>Logic testing</subject><subject>Temperature dependence</subject><subject>Temperature distribution</subject><isbn>9781424433650</isbn><isbn>1424433657</isbn><isbn>9782355000089</isbn><isbn>2355000085</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotT9tKxDAUjIigrP0CQfIDrSeX0yaPUla3sCrI-ryk6YlGuq009cG_t647L8MwwzDD2K2AQgiwd7vN-vWpeW7qQgKYQpeltUKfscxWRipEWGDs-VELLbVWqkS4ZFlKn3-eRlVVcMV0PQ4pdjS5OY4DHwOfP2g6uJ5TCOTnxOPA-_E9ep7i4bs_xq7ZRXB9ouzEK_b2sN7Vm3z78tjU99s8igrnvHToWqlJtNASYiccAFmrOiuc9Ohg2WyULwMtbvBY-c50LXowSOSUVCt2898biWj_NcWDm372p6_qFzfuSQA</recordid><startdate>200809</startdate><enddate>200809</enddate><creator>Nagy, G.</creator><creator>Horvath, G.</creator><creator>Poppe, A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200809</creationdate><title>Consideration of thermal effects in logic simulation</title><author>Nagy, G. ; Horvath, G. ; Poppe, A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-6a5ab24e1b0be55d1a00e993d91a2c5a069983c6fee55fc57cd8db5c085eea323</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Circuit simulation</topic><topic>Delay estimation</topic><topic>Digital circuits</topic><topic>Digital simulation</topic><topic>Engines</topic><topic>Logic circuits</topic><topic>Logic gates</topic><topic>Logic testing</topic><topic>Temperature dependence</topic><topic>Temperature distribution</topic><toplevel>online_resources</toplevel><creatorcontrib>Nagy, G.</creatorcontrib><creatorcontrib>Horvath, G.</creatorcontrib><creatorcontrib>Poppe, A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nagy, G.</au><au>Horvath, G.</au><au>Poppe, A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Consideration of thermal effects in logic simulation</atitle><btitle>2008 14th International Workshop on Thermal Inveatigation of ICs and Systems</btitle><stitle>THERMINIC</stitle><date>2008-09</date><risdate>2008</risdate><spage>229</spage><epage>234</epage><pages>229-234</pages><isbn>9781424433650</isbn><isbn>1424433657</isbn><eisbn>9782355000089</eisbn><eisbn>2355000085</eisbn><abstract>This paper presents a method that considers thermal effects in logic simulations. The aim is to develop a tool that is capable of modeling the thermal behavior of a digital circuit and, at the same time, yields results almost at the speed of ordinary logic simulators. The importance of such a simulation is that thermal effects can be the cause of signal integrity problems. The structure and the basic operation of the simulator are discussed as well as the issues that need to be addressed throughout the development. A detailed description of the implementation of the tightly integrated thermal and logic simulation is also given.</abstract><pub>IEEE</pub><doi>10.1109/THERMINIC.2008.4669914</doi><tpages>6</tpages></addata></record> |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Circuit simulation Delay estimation Digital circuits Digital simulation Engines Logic circuits Logic gates Logic testing Temperature dependence Temperature distribution |
| title | Consideration of thermal effects in logic simulation |
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