Consideration of thermal effects in logic simulation

This paper presents a method that considers thermal effects in logic simulations. The aim is to develop a tool that is capable of modeling the thermal behavior of a digital circuit and, at the same time, yields results almost at the speed of ordinary logic simulators. The importance of such a simulation is that thermal effects can be the cause of signal integrity problems. The structure and the basic operation of the simulator are discussed as well as the issues that need to be addressed throughout the development. A detailed description of the implementation of the tightly integrated thermal and logic simulation is also given.