Improvement of Interpoly Dielectric Characteristics by Plasma Nitridation and Oxidation for Future nand Flash Memory

In this letter, plasma nitridation and oxidation on interpoly dielectric (IPD; SiO 2 -SiN-SiO 2 ) for cell programming speed and reliabilities are investigated. Nitrided top oxide with N 2 plasma shows excellent physical and electrical properties in terms of edge profile on IPD and fast programming...

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Veröffentlicht in:IEEE electron device letters 2008-11, Vol.29 (11), p.1199-1202
Hauptverfasser: Ching Yuan Ho, Chenhsin Lien, Sakamoto, Y., Ru Jye Yang, Fijita, H., Liu, C.H., Lin, Y.M., Pittikoun, S., Aritome, S.
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Sprache:eng
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Zusammenfassung:In this letter, plasma nitridation and oxidation on interpoly dielectric (IPD; SiO 2 -SiN-SiO 2 ) for cell programming speed and reliabilities are investigated. Nitrided top oxide with N 2 plasma shows excellent physical and electrical properties in terms of edge profile on IPD and fast programming voltage. However, plasma nitridation on a floating gate suffers from data retention problems that result from nitridelike residue along the word line. A method to densify and reoxidize bottom oxide with O 2 plasma oxidation is proposed for leakage path inhibition and data retention improvement.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2008.2004972