Photonic component and subsystem reliability modeling

Photonic component and subsystem reliability modeling

The focus of the project being summarized herein is to develop a method for predicting the reliability of photonic components and assemblies that is compatible with MIL-HDBK-217, so that system level designers can efficiently estimate the reliability of systems using fiber optics and photonics. Phot...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Nicholls, D., Avak, A., Mazurowski, J.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Optical fiber cables
Optical fibers
Photonics
Reliability
Reliability engineering
Stress
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Beschreibung
Zusammenfassung:The focus of the project being summarized herein is to develop a method for predicting the reliability of photonic components and assemblies that is compatible with MIL-HDBK-217, so that system level designers can efficiently estimate the reliability of systems using fiber optics and photonics. Photonic part types being addressed in this study are: WDMs (Thin film and Fiber based), Couplers (fiber), Taps, Bandsplitters, Isolators, Optical Fiber, Laser pump modules, Photodiodes, Transmitters, Receivers, Transceivers, Filters, Variable Optical Attenuators (VOAs), Fiber connectors, Cable assemblies, and Splices.
DOI:10.1109/AVFOP.2008.4653170