N-Face Metal-Insulator-Semiconductor High-Electron-Mobility Transistors With AlN Back-Barrier
We present a high-performance SiN/AlGaN (cap)/GaN (channel)/AlN (barrier)/GaN (buffer) metal-insulator-semiconductor high-electron-mobility transistor grown on the N-face, in which the 2-D electron gas (2DEG) is induced at the top GaN/AlN interface. The use of AlN eliminates alloy disorder scatterin...
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Veröffentlicht in: | IEEE electron device letters 2008-10, Vol.29 (10), p.1101-1104 |
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Hauptverfasser: | , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | We present a high-performance SiN/AlGaN (cap)/GaN (channel)/AlN (barrier)/GaN (buffer) metal-insulator-semiconductor high-electron-mobility transistor grown on the N-face, in which the 2-D electron gas (2DEG) is induced at the top GaN/AlN interface. The use of AlN eliminates alloy disorder scattering to the 2DEG and provides strong back-barrier confinement of the 2DEG under high electric fields for device scaling. Devices with 0.7-mum gate length showed a current-gain cutoff frequency ( fT ) of 17 GHz and a power-gain cutoff frequency ( f max ) of 37 GHz. A continuous-wave output power density of 7.1 W/mm was measured at 4 GHz, with 58% power-added efficiency and a large-signal gain of 15.3 dB at a drain bias of 35 V. |
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ISSN: | 0741-3106 1558-0563 |
DOI: | 10.1109/LED.2008.2003543 |