N-Face Metal-Insulator-Semiconductor High-Electron-Mobility Transistors With AlN Back-Barrier

We present a high-performance SiN/AlGaN (cap)/GaN (channel)/AlN (barrier)/GaN (buffer) metal-insulator-semiconductor high-electron-mobility transistor grown on the N-face, in which the 2-D electron gas (2DEG) is induced at the top GaN/AlN interface. The use of AlN eliminates alloy disorder scatterin...

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Veröffentlicht in:IEEE electron device letters 2008-10, Vol.29 (10), p.1101-1104
Hauptverfasser: Man Hoi Wong, Yi Pei, Rongming Chu, Rajan, S., Swenson, B.L., Brown, D.F., Keller, S., DenBaars, S.P., Speck, J.S., Mishra, U.K.
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Sprache:eng
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Zusammenfassung:We present a high-performance SiN/AlGaN (cap)/GaN (channel)/AlN (barrier)/GaN (buffer) metal-insulator-semiconductor high-electron-mobility transistor grown on the N-face, in which the 2-D electron gas (2DEG) is induced at the top GaN/AlN interface. The use of AlN eliminates alloy disorder scattering to the 2DEG and provides strong back-barrier confinement of the 2DEG under high electric fields for device scaling. Devices with 0.7-mum gate length showed a current-gain cutoff frequency ( fT ) of 17 GHz and a power-gain cutoff frequency ( f max ) of 37 GHz. A continuous-wave output power density of 7.1 W/mm was measured at 4 GHz, with 58% power-added efficiency and a large-signal gain of 15.3 dB at a drain bias of 35 V.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2008.2003543