A microstrip antenna with flip-chip interconnect for millimetre wave transceiver on CMOS

In this work, a new CPW-fed microstrip (patch) antenna concept for integration with mm-wave transceiver circuits is presented. The antenna is designed and fabricated using standard printed circuit board technology. The attachment to the CMOS die is achieved through flip-chip bonding. The performance of the design and quality of flip-bonding process are verified by measurements through a -10 dB return loss bandwidth of 8 GHz. The measured and simulated results encourage us to go step further and integrate proposed antenna into the 60 GHz transceiver package.