Improved heat-dissipating silicone by Nano-materials for LED packaging

Improved heat-dissipating silicone by Nano-materials for LED packaging

Nano-diamond particles with the size of 5 nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-visible optical transmittance spectroscopy, and hot disk thermal constant analysis instrument. The res...

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Hauptverfasser: Cao, M.L., Pang, F.Y., Zhang, M.C., Cheng, Z.J., Gao, Y., He, P.G., Pane, L.K., Sung, Z.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Conferences
LED packaging
Nano-diamond
Nanoelectronics
Thermal conductivity
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Beschreibung
Zusammenfassung:Nano-diamond particles with the size of 5 nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-visible optical transmittance spectroscopy, and hot disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.
ISSN:2159-3523
DOI:10.1109/INEC.2008.4585595