Application of Thin-Film RCLG Model for the Modeling of Inkjet Printed Microstrip Lines

Conductor thickness arising from printable electronics manufacturing technology is typically of the order of a skin depth in the frequency range from the upper UHF band to the lower SHF band. Modeling these conductors using standard circuit models however yield inaccurate results whereas full-wave modeling is very time consuming. In this paper, a circuit simulation model based on the surface resistance of a thin penetrable conductor is presented. The proposed model is validated by comparison with full-wave simulation results, Comparison with a conventional circuit-simulation model shows improved accuracy in the loss calculation.