Design and CAD for 3D integrated circuits

High density Through Silicon Vias (TSV) can be used to build 3DICs that enable unique applications in computing, signal processing and memory intensive systems. This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a...

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Bibliographische Detailangaben
Hauptverfasser:	Franzon, Paul D., Davis, W. Rhett, Steer, Michael B., Lipa, Steve, Oh, Eun Chu, Thorolfsson, Thor, Melamed, Samson, Luniya, Sonali, Doxsee, Tad, Berkeley, Stephen, Shani, Ben, Obermiller, Kurt
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	3DIC Bandwidth Costs Delay Design automation Hardware > Emerging technologies Hardware > Integrated circuits Hardware > Very large scale integration design Integrated circuit interconnections Logic Silicon Thermal conductivity Thermal Modeling Three-dimensional integrated circuits Through Silicon Via Through-silicon vias TSV
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