Design and CAD for 3D integrated circuits

Design and CAD for 3D integrated circuits

High density Through Silicon Vias (TSV) can be used to build 3DICs that enable unique applications in computing, signal processing and memory intensive systems. This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a...

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Bibliographische Detailangaben
Hauptverfasser: Franzon, Paul D., Davis, W. Rhett, Steer, Michael B., Lipa, Steve, Oh, Eun Chu, Thorolfsson, Thor, Melamed, Samson, Luniya, Sonali, Doxsee, Tad, Berkeley, Stephen, Shani, Ben, Obermiller, Kurt
Format: Tagungsbericht
Sprache:eng
Schlagworte:
3DIC
Bandwidth
Costs
Delay
Design automation
Hardware > Emerging technologies
Hardware > Integrated circuits
Hardware > Very large scale integration design
Integrated circuit interconnections
Logic
Silicon
Thermal conductivity
Thermal Modeling
Three-dimensional integrated circuits
Through Silicon Via
Through-silicon vias
TSV
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Beschreibung
Zusammenfassung:High density Through Silicon Vias (TSV) can be used to build 3DICs that enable unique applications in computing, signal processing and memory intensive systems. This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a SAR processor. The CAD flow used to implement for these designs is described. 3DIC requires higher fidelity thermal modeling than 2DIC design. The rationale for this requirement is established and a possible solution is presented.
ISSN:0738-100X
DOI:10.1145/1391469.1391642