Ultra Wideband Vias and Power Dividers in Microstrip-Slot Technology

Ultra Wideband Vias and Power Dividers in Microstrip-Slot Technology

The design of ultra-wideband vias and power dividers in microstrip-slot technology is presented. The devices employ two substrates supported by a common ground plane. Their design is accomplished with the use of commercially available full EM analysis and design software. Low insertion loss and good...

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Bibliographische Detailangaben
Hauptverfasser: Seman, N., Bialkowski, M.E., Wee Chang Khor
Format: Tagungsbericht
Sprache:eng
Schlagworte:
component
Frequency
Insertion loss
Integrated circuit interconnections
Microstrip
Microwave circuits
Microwave technology
multilayer
Nonhomogeneous media
power divider
Power dividers
Slotline
Ultra wideband technology
via
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Beschreibung
Zusammenfassung:The design of ultra-wideband vias and power dividers in microstrip-slot technology is presented. The devices employ two substrates supported by a common ground plane. Their design is accomplished with the use of commercially available full EM analysis and design software. Low insertion loss and good return loss performances over an ultra wide frequency band for the designed structures are noted.
ISSN:2165-4727
2165-4743
DOI:10.1109/APMC.2007.4555115