RF MEMS Switch ASICS
This paper describes the combination of a novel "device on package" MEMS fabrication architecture and proven high force disk actuator technology to enable new families of MEMS Switch ASIC's (Application Specific Integrated Circuits). This includes both custom high performance MEMS swi...
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Format: | Tagungsbericht |
Sprache: | eng |
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Zusammenfassung: | This paper describes the combination of a novel "device on package" MEMS fabrication architecture and proven high force disk actuator technology to enable new families of MEMS Switch ASIC's (Application Specific Integrated Circuits). This includes both custom high performance MEMS switches and MEMS switches integrated with passive components. Initial demonstrations of this capability include the fabrication of increasingly complex multipole-multithrow switches (DPDT and SP4T) with RF performance comparable to existing SPDT switches based on this same architecture. Integration of resistors with this switch architecture has also been shown to extend the bandwidth of these devices from DC to 26 GHz. Integration of high quality inductors and capacitors on the "back side" of these devices is also shown to enable the fabrication of high performance switchable filters and match networks. |
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ISSN: | 2165-4727 2165-4743 |
DOI: | 10.1109/APMC.2007.4554690 |