Development and performance characterizations of a QFN/HMT package

Development and performance characterizations of a QFN/HMT package

In this paper, application advantages, development, and fabrication process of aQFN/HMT is introduced. Identical functions are intentionally designed in both CSP- BGA and aQFN/HMT packaging structures so that thermal and electrical performances of these two structures can be reasonably compared and...

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Hauptverfasser: Yi-Shao Lai, Pao-Huei Chang-Chien, Chi-Wen Chang, Tsung-Yueh Tsai, Sung-Ching Hung, Tseng, A., Keiji Takai, Hirashima, T.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Chip scale packaging
Costs
Electronic packaging thermal management
Electronics packaging
Etching
Fabrication
Lead
Semiconductor device packaging
Thermomechanical processes
Wafer scale integration
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Beschreibung
Zusammenfassung:In this paper, application advantages, development, and fabrication process of aQFN/HMT is introduced. Identical functions are intentionally designed in both CSP- BGA and aQFN/HMT packaging structures so that thermal and electrical performances of these two structures can be reasonably compared and demonstrated. Our calculations indicate that thermal and electrical performances of aQFN/HMT are much better than CSP-BGA, when the same functions are designed in.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2008.4550092