Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D package

This paper presents micro fabrication process and wafer level integration of a silicon carrier, in which optimized liquid cooling layers are embedded. Two or more carriers can then be stacked together with a silicon interposer in between to make up of a stacked cooling module for high power heat dis...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Aibin Yu, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh, Kripesh, V., Seung Wook Yoon, Lau, J.H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Fabrication Liquid cooling Packaging Power system management Silicon Stacking Thermal management Through-silicon vias Wafer bonding Wafer scale integration
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