Electrical characterization of trough silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation

In this paper, we show the electrical characteristics of TSV (Through Silicon Via) depending on structural parameters such as TSV pitch, TSV height, TSV size and thickness of SiO 2 for DC leakage blocking between TSV and silicon substrate, and material parameter of silicon substrate such as silicon resistivity in case of single silicon substrate. And we also show X-talk characteristics of two TSVs depending on distance of two signal TSVs and different locations of two signal TSVs and two ground TSVs in array type arrangement of TSV. Additionally, we show the electrical characteristics of TSV depending on number of stacked TSVs. All electrical characterizations on this paper are obtained using commercial 3-D full wave simulator and spice type circuit simulator such as HFSS of Ansoft Corporation and ADS of Agilent Corporation, respectively.