High Filled Epoxy Composites for Electronic Packaging Application

High Filled Epoxy Composites for Electronic Packaging Application

Increasing demands in the electronic packaging industries have led to the need for high-performance organic substrate material like epoxy composites. This paper investigates the effect of ethanol as diluent in epoxy composites containing 0 to 60 vol% of mineral silica. Flexural properties of epoxy c...

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Hauptverfasser: Teh, P.L., Mariatti, M., Akil, H.M., Seetharamu, K.N., Wagiman, A.N.R., Beh, K.S.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Composite materials
Electronic packaging thermal management
Electronics industry
Electronics packaging
Ethanol
Mechanical factors
Minerals
Organic materials
Silicon compounds
Temperature
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Zusammenfassung:Increasing demands in the electronic packaging industries have led to the need for high-performance organic substrate material like epoxy composites. This paper investigates the effect of ethanol as diluent in epoxy composites containing 0 to 60 vol% of mineral silica. Flexural properties of epoxy composites were studied at room temperature. Thermal properties were studied using dilatomater, dynamic mechanical analyzer (DMA) and thermogravimetric analysis (TGA). In overall, the properties of the epoxy composites are depend on the filler loading and the addition of ethanol as diluent.
ISSN:1089-8190
DOI:10.1109/IEMT.2006.4456466