A new methodology for extraction of dynamic compact thermal models

An innovative and accurate dynamic compact thermal model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily be taken into account by system designers. The method is base...

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Bibliographische Detailangaben
Hauptverfasser:	Habra, W., Tounsi, P., Madrid, F., Dupuy, P., Barbot, C., Dorkel, J.-M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Automotive engineering Coupling circuits Electronic packaging thermal management MOSFETs Power electronics Power engineering and energy Power system modeling Temperature Vehicle dynamics Virtual manufacturing
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Beschreibung
Zusammenfassung:	An innovative and accurate dynamic compact thermal model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily be taken into account by system designers. The method is based on a definition of the optimal thermal coupling point, which is proven to be valid even for transient modelling. Compared to the existing methods, the number of needed 3D thermal simulations or measurements is significantly reduced.
DOI:	10.1109/THERMINIC.2007.4451766