Perspectives on integrated metrology and wafer-level control

In this paper, we will discuss the critical factors that are driving the implementation progress of integrated metrology (IM) and wafer-level advanced process control (APC). We will describe the potential benefits of IM and the engineering roadblocks that have limited the realization of those benefits. Finally, we will describe AMD's approach to solving the wafer-level control problem by using stand-alone metrology, dynamic wafer sampling, and a bias correction algorithm.