A 1.1 GHz 12 \muA/Mb-Leakage SRAM Design in 65 nm Ultra-Low-Power CMOS Technology With Integrated Leakage Reduction for Mobile Applications

A low-power, high-speed SRAM macro is designed in a 65 nm ultra-low-power (ULP) logic technology for mobile applications. The 65 nm strained silicon technology improves transistor performance/leakage tradeoff, which is essential to achieve fast SRAM access speed at substantially low operating voltag...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE journal of solid-state circuits 2008-01, Vol.43 (1), p.172-179
Hauptverfasser: Yih Wang, Hong Jo Ahn, Bhattacharya, U., Zhanping Chen, Coan, T., Hamzaoglu, F., Hafez, W.M., Chia-Hong Jan, Kolar, P., Kulkarni, S.H., Jie-Feng Lin, Yong-Gee Ng, Post, I., Liqiong Wei, Ying Zhang, Zhang, K., Bohr, M.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A low-power, high-speed SRAM macro is designed in a 65 nm ultra-low-power (ULP) logic technology for mobile applications. The 65 nm strained silicon technology improves transistor performance/leakage tradeoff, which is essential to achieve fast SRAM access speed at substantially low operating voltage and standby leakage. The 1 Mb SRAM macro features a 0.667 mum 2 low-leakage memory cell and can operate over a wide range of supply voltages from 1.2 V to 0.5 V. It achieves operating frequency of 1.1 GHz and 250 MHz at 1.2 V and 0.7 V, respectively. The SRAM leakage is reduced to 12 muA/Mb at the data retention voltage of 0.5 V. The measured bitcell leakage from the SRAM array is ~2 pA/bit at retention voltage with integrated leakage reduction schemes.
ISSN:0018-9200
1558-173X
DOI:10.1109/JSSC.2007.907996