The influence of reflow peak temperature on BGA solder joints' mechanical reliability in backside compatible soldering

The article consists of a Powerpoint presentation on BGA solder joints' mechanical reliability in backside compatible soldering. The paper concludes that the solder joints' mechanical property in backside compatible soldering is as good as pure lead-free assembly; The failure location of s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Limin Chen, Sang Liu, Yuming Ye, Yunhua Tu, Zhiwei Song, Zhao Xiang, Zhi Xu
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!