The influence of reflow peak temperature on BGA solder joints' mechanical reliability in backside compatible soldering
The article consists of a Powerpoint presentation on BGA solder joints' mechanical reliability in backside compatible soldering. The paper concludes that the solder joints' mechanical property in backside compatible soldering is as good as pure lead-free assembly; The failure location of s...
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Format: | Tagungsbericht |
Sprache: | eng |
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