The influence of reflow peak temperature on BGA solder joints' mechanical reliability in backside compatible soldering

The article consists of a Powerpoint presentation on BGA solder joints' mechanical reliability in backside compatible soldering. The paper concludes that the solder joints' mechanical property in backside compatible soldering is as good as pure lead-free assembly; The failure location of solder joint in component shearing test is between solder pad and resin; The failure location in multi-time 4-points bending test is on the pad connected to lines; Taking 220degC as reflow peak temperature can get good Pb uniformity in solder joint; The reliability conclusion of mixed soldering mainly depends on ATC result.