Influence of Ni-Sn-Cu ternary intermetallic compound on solder joint reliability

Influence of Ni-Sn-Cu ternary intermetallic compound on solder joint reliability

A collection of slides from the author's conference presentation is given.

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Bibliographische Detailangaben
Hauptverfasser: Yunhua Tu, Sang Liu, Yuming Ye, Limin Chen
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Cooling
Copper
Diffraction
Etching
Finishing
Intermetallic
Soldering
Surface cracks
Surface morphology
US Department of Transportation
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Beschreibung
Zusammenfassung:A collection of slides from the author's conference presentation is given.
DOI:10.1109/EMAP.2006.4430698