On-wafer level packaging of RF MEMS devices for Ka-band applications
In this paper, on-wafer level packaging technology for RF MEMS is described, and then a novel packaging design for RF MEMS devices with different fabrication technology at millimeter-wave band is presented. The discussed RF MEMS devices on naked wafer includes a MEMS filter and a distributed MEMS tr...
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creator | Qun Wu Bo-Shi Jin Xun-Jun He Kai Tang Fang Zhang Jong-Chul Lee |
description | In this paper, on-wafer level packaging technology for RF MEMS is described, and then a novel packaging design for RF MEMS devices with different fabrication technology at millimeter-wave band is presented. The discussed RF MEMS devices on naked wafer includes a MEMS filter and a distributed MEMS transmission line (DMTL) phase shifter, which are fabricated using LIGA and micromachined technology, respectively. In order to realize the integration of those devices into a system at millimeter wave band, the packaged devices are embedded in a substrate. After incorporating the parasitic parameters into the equivalent circuit for the phase shifter, it is found that the bandwidth of predicted packaging increases about 8 GHz, moreover, the predicted packaging area is only about 40% larger than the naked device. |
doi_str_mv | 10.1109/APMC.2006.4429446 |
format | Conference Proceeding |
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After incorporating the parasitic parameters into the equivalent circuit for the phase shifter, it is found that the bandwidth of predicted packaging increases about 8 GHz, moreover, the predicted packaging area is only about 40% larger than the naked device.</description><subject>distributed MEMS transmission line (DMTL)</subject><subject>Distributed parameter circuits</subject><subject>Fabrication</subject><subject>filter</subject><subject>Filters</subject><subject>Micromechanical devices</subject><subject>Millimeter wave circuits</subject><subject>Millimeter wave devices</subject><subject>Millimeter wave technology</subject><subject>on-wafer packaging</subject><subject>Packaging</subject><subject>phase shifter</subject><subject>Phase shifters</subject><subject>phased array antenna</subject><subject>Radiofrequency microelectromechanical systems</subject><subject>RF MEMS</subject><issn>2165-4727</issn><issn>2165-4743</issn><isbn>9784902339086</isbn><isbn>4902339080</isbn><isbn>9784902339116</isbn><isbn>4902339110</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpNkMtKw0AYRscbWGoeQNzMC0ycy5-5LEtsVWyoaPflTzJTRmMaklLp2xuwiKuzOHD4-Ai5FTwVgrv72WuRp5JznQJIB6DPSOKMBcelUk4IfU4mUuiMgQF18d9xqy__nDTXJBmGD875GBMC1IQ8rFr2jcH3tPEH39AOq0_cxnZLd4G-LWgxL95p7Q-x8gMNu56-ICuxrSl2XRMr3MddO9yQq4DN4JMTp2S9mK_zJ7ZcPT7nsyWLju9ZECAMr8FVtQ7WZXpcECwKzCCA9VKbUJYGcGTthJUhsxYws15XxqoyqCm5-81G7_2m6-MX9sfN6RL1A8sgTks</recordid><startdate>200612</startdate><enddate>200612</enddate><creator>Qun Wu</creator><creator>Bo-Shi Jin</creator><creator>Xun-Jun He</creator><creator>Kai Tang</creator><creator>Fang Zhang</creator><creator>Jong-Chul Lee</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200612</creationdate><title>On-wafer level packaging of RF MEMS devices for Ka-band applications</title><author>Qun Wu ; Bo-Shi Jin ; Xun-Jun He ; Kai Tang ; Fang Zhang ; Jong-Chul Lee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-f14170d49cd6f8956114f8a1a54f48e267fbb74a67fd9182f5884a58e6c783bf3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>distributed MEMS transmission line (DMTL)</topic><topic>Distributed parameter circuits</topic><topic>Fabrication</topic><topic>filter</topic><topic>Filters</topic><topic>Micromechanical devices</topic><topic>Millimeter wave circuits</topic><topic>Millimeter wave devices</topic><topic>Millimeter wave technology</topic><topic>on-wafer packaging</topic><topic>Packaging</topic><topic>phase shifter</topic><topic>Phase shifters</topic><topic>phased array antenna</topic><topic>Radiofrequency microelectromechanical systems</topic><topic>RF MEMS</topic><toplevel>online_resources</toplevel><creatorcontrib>Qun Wu</creatorcontrib><creatorcontrib>Bo-Shi Jin</creatorcontrib><creatorcontrib>Xun-Jun He</creatorcontrib><creatorcontrib>Kai Tang</creatorcontrib><creatorcontrib>Fang Zhang</creatorcontrib><creatorcontrib>Jong-Chul Lee</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Qun Wu</au><au>Bo-Shi Jin</au><au>Xun-Jun He</au><au>Kai Tang</au><au>Fang Zhang</au><au>Jong-Chul Lee</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>On-wafer level packaging of RF MEMS devices for Ka-band applications</atitle><btitle>2006 Asia-Pacific Microwave Conference</btitle><stitle>APMC</stitle><date>2006-12</date><risdate>2006</risdate><spage>389</spage><epage>394</epage><pages>389-394</pages><issn>2165-4727</issn><eissn>2165-4743</eissn><isbn>9784902339086</isbn><isbn>4902339080</isbn><eisbn>9784902339116</eisbn><eisbn>4902339110</eisbn><abstract>In this paper, on-wafer level packaging technology for RF MEMS is described, and then a novel packaging design for RF MEMS devices with different fabrication technology at millimeter-wave band is presented. 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identifier | ISSN: 2165-4727 |
ispartof | 2006 Asia-Pacific Microwave Conference, 2006, p.389-394 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | distributed MEMS transmission line (DMTL) Distributed parameter circuits Fabrication filter Filters Micromechanical devices Millimeter wave circuits Millimeter wave devices Millimeter wave technology on-wafer packaging Packaging phase shifter Phase shifters phased array antenna Radiofrequency microelectromechanical systems RF MEMS |
title | On-wafer level packaging of RF MEMS devices for Ka-band applications |
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