Synthesis and dielectric properties of poly(epoxyimide)-nano silica hybrid film by CS sol process
The new PEI-ano Silica hybrid films prepared from CS sol process have a stable chemical bonding and uniform distribution of nano silica. The decrease property of dielectric constant with CS content, and tangent loss consistent of given frequency and temperature was explained in terms of the chain mo...
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| creator | Se Won Han Dong Hee Han Dong Pil Kang Young Taec Kang Suck Jun Kim |
| description | The new PEI-ano Silica hybrid films prepared from CS sol process have a stable chemical bonding and uniform distribution of nano silica. The decrease property of dielectric constant with CS content, and tangent loss consistent of given frequency and temperature was explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. PEI-CS sol hybrid film with such stable chemical and dielectric properties is expected to be used as high functional coating application in ET, IT and electric power products. |
| doi_str_mv | 10.1109/NMDC.2006.4388934 |
| format | Conference Proceeding |
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The decrease property of dielectric constant with CS content, and tangent loss consistent of given frequency and temperature was explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. PEI-CS sol hybrid film with such stable chemical and dielectric properties is expected to be used as high functional coating application in ET, IT and electric power products.</description><subject>Bonding</subject><subject>Chemical processes</subject><subject>Chemical products</subject><subject>Coatings</subject><subject>CS sol</subject><subject>Dielectric constant</subject><subject>dielectric constant and tangent loss</subject><subject>Dielectric losses</subject><subject>Frequency</subject><subject>nano silica dipersion</subject><subject>PEI-Silica bybrid</subject><subject>Polymers</subject><subject>Silicon compounds</subject><subject>Temperature</subject><isbn>9781424405404</isbn><isbn>1424405408</isbn><isbn>1424405416</isbn><isbn>9781424405411</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2006</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1UEtLw0AYXJGCVvsDxMse9ZC6r2Z3jxKfUPVQPZd9fEs_SZOQzcH8e1OscxlmGAZmCLnibMk5s3fvbw_VUjBWLpU0xkp1QuZcCaXYSvHylCysNv-aqRmZH7JWMib0GVnk_M0mSFtO5jlxm7EZdpAxU9dEGhFqCEOPgXZ920E_IGTaJtq19XgDXfsz4h4j3BaNa1qascbg6G70PUaasN5TP9JqQ3NbHwoC5HxJZsnVGRZHviBfT4-f1Uux_nh-re7XBXK9GgquSmG0FtFEw8Cn6L3wSqRUmpisdVGJ4LwW3oiYmDYrH4JSHiZyctoiL8j1Xy8CwLbrce_6cXu8SP4CxYVZ0Q</recordid><startdate>200610</startdate><enddate>200610</enddate><creator>Se Won Han</creator><creator>Dong Hee Han</creator><creator>Dong Pil Kang</creator><creator>Young Taec Kang</creator><creator>Suck Jun Kim</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200610</creationdate><title>Synthesis and dielectric properties of poly(epoxyimide)-nano silica hybrid film by CS sol process</title><author>Se Won Han ; Dong Hee Han ; Dong Pil Kang ; Young Taec Kang ; Suck Jun Kim</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-14628772d8d80ebfdbb2b42ff68df99ad42cab72b82df0785bcc44bebcca36063</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2006</creationdate><topic>Bonding</topic><topic>Chemical processes</topic><topic>Chemical products</topic><topic>Coatings</topic><topic>CS sol</topic><topic>Dielectric constant</topic><topic>dielectric constant and tangent loss</topic><topic>Dielectric losses</topic><topic>Frequency</topic><topic>nano silica dipersion</topic><topic>PEI-Silica bybrid</topic><topic>Polymers</topic><topic>Silicon compounds</topic><topic>Temperature</topic><toplevel>online_resources</toplevel><creatorcontrib>Se Won Han</creatorcontrib><creatorcontrib>Dong Hee Han</creatorcontrib><creatorcontrib>Dong Pil Kang</creatorcontrib><creatorcontrib>Young Taec Kang</creatorcontrib><creatorcontrib>Suck Jun Kim</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Se Won Han</au><au>Dong Hee Han</au><au>Dong Pil Kang</au><au>Young Taec Kang</au><au>Suck Jun Kim</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Synthesis and dielectric properties of poly(epoxyimide)-nano silica hybrid film by CS sol process</atitle><btitle>2006 IEEE Nanotechnology Materials and Devices Conference</btitle><stitle>NMDC</stitle><date>2006-10</date><risdate>2006</risdate><volume>1</volume><spage>624</spage><epage>625</epage><pages>624-625</pages><isbn>9781424405404</isbn><isbn>1424405408</isbn><eisbn>1424405416</eisbn><eisbn>9781424405411</eisbn><abstract>The new PEI-ano Silica hybrid films prepared from CS sol process have a stable chemical bonding and uniform distribution of nano silica. The decrease property of dielectric constant with CS content, and tangent loss consistent of given frequency and temperature was explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. PEI-CS sol hybrid film with such stable chemical and dielectric properties is expected to be used as high functional coating application in ET, IT and electric power products.</abstract><pub>IEEE</pub><doi>10.1109/NMDC.2006.4388934</doi><tpages>2</tpages></addata></record> |
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| ispartof | 2006 IEEE Nanotechnology Materials and Devices Conference, 2006, Vol.1, p.624-625 |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Bonding Chemical processes Chemical products Coatings CS sol Dielectric constant dielectric constant and tangent loss Dielectric losses Frequency nano silica dipersion PEI-Silica bybrid Polymers Silicon compounds Temperature |
| title | Synthesis and dielectric properties of poly(epoxyimide)-nano silica hybrid film by CS sol process |
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