Synthesis and dielectric properties of poly(epoxyimide)-nano silica hybrid film by CS sol process

Synthesis and dielectric properties of poly(epoxyimide)-nano silica hybrid film by CS sol process

The new PEI-ano Silica hybrid films prepared from CS sol process have a stable chemical bonding and uniform distribution of nano silica. The decrease property of dielectric constant with CS content, and tangent loss consistent of given frequency and temperature was explained in terms of the chain mo...

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Bibliographische Detailangaben
Hauptverfasser: Se Won Han, Dong Hee Han, Dong Pil Kang, Young Taec Kang, Suck Jun Kim
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Bonding
Chemical processes
Chemical products
Coatings
CS sol
Dielectric constant
dielectric constant and tangent loss
Dielectric losses
Frequency
nano silica dipersion
PEI-Silica bybrid
Polymers
Silicon compounds
Temperature
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Beschreibung
Zusammenfassung:The new PEI-ano Silica hybrid films prepared from CS sol process have a stable chemical bonding and uniform distribution of nano silica. The decrease property of dielectric constant with CS content, and tangent loss consistent of given frequency and temperature was explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. PEI-CS sol hybrid film with such stable chemical and dielectric properties is expected to be used as high functional coating application in ET, IT and electric power products.
DOI:10.1109/NMDC.2006.4388934