The GHz region characteristic of the BGA-printed wired board interconnection by conductive adhesives

It is research of a part of NEDO project "High temperature solder substitution/electric conductive adhesives development." BGA by FR-4 and printed wired board by FR-4 were connected using first development article XA-5554 of silver and epoxy electric conduction adhesives,the 5GHz (10Gbps) input signal in BGA was examined. And the high frequency signal and power supply characteristics of the conductive adhesives were measured. Differential signal of 10Gbps into the connections which it passed through eight daisy chains, power carried out perfectly for 10Gbps operation. Also the actual driver system which power connection passed through eight daisy chains, operated 3Gbps. As the conclusion, it was clarified that the first trial product has a high-speed signal transmission performance enough.