Recent Trend of Optical Circuit Board in Taiwan

Optical interconnects (OI) prove ways to overcome the high power consumption, large footprint, high integration density, signal latency and skew issues at high speed data transmission. In this paper, the research accomplishments of optical polymer waveguide, high speed optoelectronic packages, rigid...

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Bibliographische Detailangaben
Hauptverfasser:	Lee, Shin-Ge, Lee, Chun-Hsing, Lu, Chien Chun, Cheng, Fu-Yi, Shen, Kun-Yi, Huang, Sheng-Ho, Shen, Li-Cheng, Chang, Shu-Ming, Chang, Hsiang-Hung, Fu, Huan-Chun, Tien, Pei, Chu, Mu-Tao, Chan, Yi-Jen
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Data communication Delay Energy consumption Flexible printed circuits High speed optical techniques optical interconnect Optical interconnections Optical polymers Optical waveguides optoelectronic printed circuit board Packaging Polymer waveguide Printed circuits
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Beschreibung
Zusammenfassung:	Optical interconnects (OI) prove ways to overcome the high power consumption, large footprint, high integration density, signal latency and skew issues at high speed data transmission. In this paper, the research accomplishments of optical polymer waveguide, high speed optoelectronic packages, rigid and flexible optoelectronic printed circuit board (OEPCB) for high speed board to board, and chip to chip optical interconnects develop in Taiwan have demonstrated and discussed.
DOI:	10.1109/POLYTR.2007.4339163