Enhancement of Flip-Chip Light-Emitting Diodes With Omni-Directional Reflector and Textured Micropillar Arrays

The flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The l...

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Veröffentlicht in:	IEEE photonics technology letters 2007-08, Vol.19 (16), p.1200-1202
Hauptverfasser:	Chia-En Lee, Yi-Jiun Lee, Hao-Chung Kuo, Meng-Ru Tsai, Cheng, B.S., Tien-Chang Lu, Shing-Chung Wang, Chia-Tai Kuo
Format:	Artikel
Sprache:	eng
Schlagworte:	Arrays Devices Dry etching Drying Etching flip-chip light-emitting diodes (FC-LEDs) Light emitting diodes micropillar-array Mirrors omni-directional reflectors (ODRs) Optical arrays Optical reflection Photonics Power generation Reflectors Rough surfaces Sapphire Substrates Surface roughness Surface texture Thermal conductivity
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