Enhancement of Flip-Chip Light-Emitting Diodes With Omni-Directional Reflector and Textured Micropillar Arrays

Enhancement of Flip-Chip Light-Emitting Diodes With Omni-Directional Reflector and Textured Micropillar Arrays

The flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The l...

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Veröffentlicht in:IEEE photonics technology letters 2007-08, Vol.19 (16), p.1200-1202
Hauptverfasser: Chia-En Lee, Yi-Jiun Lee, Hao-Chung Kuo, Meng-Ru Tsai, Cheng, B.S., Tien-Chang Lu, Shing-Chung Wang, Chia-Tai Kuo
Format: Artikel
Sprache:eng
Schlagworte:
Arrays
Devices
Dry etching
Drying
Etching
flip-chip light-emitting diodes (FC-LEDs)
Light emitting diodes
micropillar-array
Mirrors
omni-directional reflectors (ODRs)
Optical arrays
Optical reflection
Photonics
Power generation
Reflectors
Rough surfaces
Sapphire
Substrates
Surface roughness
Surface texture
Thermal conductivity
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Beschreibung
Zusammenfassung:The flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The light output power of the FC-LED was increased by 65% for a 3.2-mum textured micropillar on the bottom side of the sapphire substrate. Our work offers promising potential for enhancing output powers of commercial light-emitting devices.
ISSN:1041-1135
1941-0174
DOI:10.1109/LPT.2007.901718