A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System

A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System

This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting...

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Bibliographische Detailangaben
Hauptverfasser: Ahmad, I., Jiun, Hoh Huey, Leng, Eu Poh, Majlis, B.Y., Jalar, A., Wagiran, R.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Aluminum alloys
Electronics packaging
Environmentally friendly manufacturing techniques
Intermetallic
Lead
Morphology
Temperature
Testing
Tin
Vehicles
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Zusammenfassung:This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that lwt%Ag 0.5wt% Cu has larger melting range compared to 3 & 4wt%Ag 0.5wt%Cu which could contribute to IMC growth. Relatively, ball shear results shows that shear strength increases with Ag wt% content. A correlation between melting range and shear results made in this study pointed to 3.8wt%Ag0.5wt%Cu having the most favorable results.
DOI:10.1109/SMELEC.2006.380690