Development and Optimization of Re-Oxidized Tunnel Oxide with Nitrogen Incorporation for the Flash Memory Applications
The reliability properties of NOR flash memory with 65nm node being developed in Samsung electronics are greatly improved by using the newly proposed re-oxidized tunnel oxide. Especially, by optimizing the process variables such as the re-oxidation thickness/time, the partial pressure of NO during a...
Gespeichert in:
Hauptverfasser: | , , , , , , , , , |
---|---|
Format: | Tagungsbericht |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 189 |
---|---|
container_issue | |
container_start_page | 184 |
container_title | |
container_volume | |
creator | Jung-Geun Jee WookHyun Kwon Woong Lee Jung-Hyun Park Hyeong-Ki Kim Ho-Min Son Won-Jun Chang Jae-Jong Han Yong-Woo Hyung Hyeon-Deok Lee |
description | The reliability properties of NOR flash memory with 65nm node being developed in Samsung electronics are greatly improved by using the newly proposed re-oxidized tunnel oxide. Especially, by optimizing the process variables such as the re-oxidation thickness/time, the partial pressure of NO during annealing, and the kinds of re-oxidizing materials, the Vth shifts post cycling and after post-cycling bake were decreased to the level of 28% and 42% of conventional NO annealed tunnel oxide, respectively. |
doi_str_mv | 10.1109/RELPHY.2007.369890 |
format | Conference Proceeding |
fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4227631</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4227631</ieee_id><sourcerecordid>4227631</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-877a03d7f22a87886638503e3bd1acc028a789cef18d703d22864c7cb758da713</originalsourceid><addsrcrecordid>eNo1jM1OwkAUhce_REReQDfzAsW5M23nzpIgCAmKIWxckaG9lTFtp2kLCk8viq5OTr7vHMbuQPQBhHlYjGavk7e-FEL3VWzQiDN2A6EMQ2HAROesA0ZhAGjggvWMxn-GcHlkUQiBFjK-Zr2m-RBCgI5DAarDdo-0o9xXBZUtt2XK51XrCnewrfMl9xlfUDD_cqk7UMqX27KknP904p-u3fAX19b-nUo-LRNfV74-7TJf83ZDfJzbZsOfqfD1ng-qKnfJr9DcsqvM5g31_rLLluPRcjgJZvOn6XAwC5wRbYBaW6FSnUlpUSPGscJIKFLrFGySCIlWo0koA0z1UZQS4zDRyVpHmFoNqsvuT7eOiFZV7Qpb71ehlDpWoL4Bt_NiFA</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Development and Optimization of Re-Oxidized Tunnel Oxide with Nitrogen Incorporation for the Flash Memory Applications</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Jung-Geun Jee ; WookHyun Kwon ; Woong Lee ; Jung-Hyun Park ; Hyeong-Ki Kim ; Ho-Min Son ; Won-Jun Chang ; Jae-Jong Han ; Yong-Woo Hyung ; Hyeon-Deok Lee</creator><creatorcontrib>Jung-Geun Jee ; WookHyun Kwon ; Woong Lee ; Jung-Hyun Park ; Hyeong-Ki Kim ; Ho-Min Son ; Won-Jun Chang ; Jae-Jong Han ; Yong-Woo Hyung ; Hyeon-Deok Lee</creatorcontrib><description>The reliability properties of NOR flash memory with 65nm node being developed in Samsung electronics are greatly improved by using the newly proposed re-oxidized tunnel oxide. Especially, by optimizing the process variables such as the re-oxidation thickness/time, the partial pressure of NO during annealing, and the kinds of re-oxidizing materials, the Vth shifts post cycling and after post-cycling bake were decreased to the level of 28% and 42% of conventional NO annealed tunnel oxide, respectively.</description><identifier>ISSN: 1541-7026</identifier><identifier>ISBN: 9781424409181</identifier><identifier>ISBN: 1424409187</identifier><identifier>EISSN: 1938-1891</identifier><identifier>EISBN: 1424409195</identifier><identifier>EISBN: 9781424409198</identifier><identifier>DOI: 10.1109/RELPHY.2007.369890</identifier><language>eng</language><publisher>IEEE</publisher><subject>Annealing ; Bonding ; Degradation ; Flash memory ; Hydrogen ; Nitrogen ; Oxidation ; Research and development ; Thermal stresses ; Threshold voltage</subject><ispartof>2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual, 2007, p.184-189</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4227631$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4227631$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Jung-Geun Jee</creatorcontrib><creatorcontrib>WookHyun Kwon</creatorcontrib><creatorcontrib>Woong Lee</creatorcontrib><creatorcontrib>Jung-Hyun Park</creatorcontrib><creatorcontrib>Hyeong-Ki Kim</creatorcontrib><creatorcontrib>Ho-Min Son</creatorcontrib><creatorcontrib>Won-Jun Chang</creatorcontrib><creatorcontrib>Jae-Jong Han</creatorcontrib><creatorcontrib>Yong-Woo Hyung</creatorcontrib><creatorcontrib>Hyeon-Deok Lee</creatorcontrib><title>Development and Optimization of Re-Oxidized Tunnel Oxide with Nitrogen Incorporation for the Flash Memory Applications</title><title>2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual</title><addtitle>RELPHY</addtitle><description>The reliability properties of NOR flash memory with 65nm node being developed in Samsung electronics are greatly improved by using the newly proposed re-oxidized tunnel oxide. Especially, by optimizing the process variables such as the re-oxidation thickness/time, the partial pressure of NO during annealing, and the kinds of re-oxidizing materials, the Vth shifts post cycling and after post-cycling bake were decreased to the level of 28% and 42% of conventional NO annealed tunnel oxide, respectively.</description><subject>Annealing</subject><subject>Bonding</subject><subject>Degradation</subject><subject>Flash memory</subject><subject>Hydrogen</subject><subject>Nitrogen</subject><subject>Oxidation</subject><subject>Research and development</subject><subject>Thermal stresses</subject><subject>Threshold voltage</subject><issn>1541-7026</issn><issn>1938-1891</issn><isbn>9781424409181</isbn><isbn>1424409187</isbn><isbn>1424409195</isbn><isbn>9781424409198</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2007</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1jM1OwkAUhce_REReQDfzAsW5M23nzpIgCAmKIWxckaG9lTFtp2kLCk8viq5OTr7vHMbuQPQBhHlYjGavk7e-FEL3VWzQiDN2A6EMQ2HAROesA0ZhAGjggvWMxn-GcHlkUQiBFjK-Zr2m-RBCgI5DAarDdo-0o9xXBZUtt2XK51XrCnewrfMl9xlfUDD_cqk7UMqX27KknP904p-u3fAX19b-nUo-LRNfV74-7TJf83ZDfJzbZsOfqfD1ng-qKnfJr9DcsqvM5g31_rLLluPRcjgJZvOn6XAwC5wRbYBaW6FSnUlpUSPGscJIKFLrFGySCIlWo0koA0z1UZQS4zDRyVpHmFoNqsvuT7eOiFZV7Qpb71ehlDpWoL4Bt_NiFA</recordid><startdate>200704</startdate><enddate>200704</enddate><creator>Jung-Geun Jee</creator><creator>WookHyun Kwon</creator><creator>Woong Lee</creator><creator>Jung-Hyun Park</creator><creator>Hyeong-Ki Kim</creator><creator>Ho-Min Son</creator><creator>Won-Jun Chang</creator><creator>Jae-Jong Han</creator><creator>Yong-Woo Hyung</creator><creator>Hyeon-Deok Lee</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200704</creationdate><title>Development and Optimization of Re-Oxidized Tunnel Oxide with Nitrogen Incorporation for the Flash Memory Applications</title><author>Jung-Geun Jee ; WookHyun Kwon ; Woong Lee ; Jung-Hyun Park ; Hyeong-Ki Kim ; Ho-Min Son ; Won-Jun Chang ; Jae-Jong Han ; Yong-Woo Hyung ; Hyeon-Deok Lee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-877a03d7f22a87886638503e3bd1acc028a789cef18d703d22864c7cb758da713</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Annealing</topic><topic>Bonding</topic><topic>Degradation</topic><topic>Flash memory</topic><topic>Hydrogen</topic><topic>Nitrogen</topic><topic>Oxidation</topic><topic>Research and development</topic><topic>Thermal stresses</topic><topic>Threshold voltage</topic><toplevel>online_resources</toplevel><creatorcontrib>Jung-Geun Jee</creatorcontrib><creatorcontrib>WookHyun Kwon</creatorcontrib><creatorcontrib>Woong Lee</creatorcontrib><creatorcontrib>Jung-Hyun Park</creatorcontrib><creatorcontrib>Hyeong-Ki Kim</creatorcontrib><creatorcontrib>Ho-Min Son</creatorcontrib><creatorcontrib>Won-Jun Chang</creatorcontrib><creatorcontrib>Jae-Jong Han</creatorcontrib><creatorcontrib>Yong-Woo Hyung</creatorcontrib><creatorcontrib>Hyeon-Deok Lee</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jung-Geun Jee</au><au>WookHyun Kwon</au><au>Woong Lee</au><au>Jung-Hyun Park</au><au>Hyeong-Ki Kim</au><au>Ho-Min Son</au><au>Won-Jun Chang</au><au>Jae-Jong Han</au><au>Yong-Woo Hyung</au><au>Hyeon-Deok Lee</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Development and Optimization of Re-Oxidized Tunnel Oxide with Nitrogen Incorporation for the Flash Memory Applications</atitle><btitle>2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual</btitle><stitle>RELPHY</stitle><date>2007-04</date><risdate>2007</risdate><spage>184</spage><epage>189</epage><pages>184-189</pages><issn>1541-7026</issn><eissn>1938-1891</eissn><isbn>9781424409181</isbn><isbn>1424409187</isbn><eisbn>1424409195</eisbn><eisbn>9781424409198</eisbn><abstract>The reliability properties of NOR flash memory with 65nm node being developed in Samsung electronics are greatly improved by using the newly proposed re-oxidized tunnel oxide. Especially, by optimizing the process variables such as the re-oxidation thickness/time, the partial pressure of NO during annealing, and the kinds of re-oxidizing materials, the Vth shifts post cycling and after post-cycling bake were decreased to the level of 28% and 42% of conventional NO annealed tunnel oxide, respectively.</abstract><pub>IEEE</pub><doi>10.1109/RELPHY.2007.369890</doi><tpages>6</tpages></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISSN: 1541-7026 |
ispartof | 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual, 2007, p.184-189 |
issn | 1541-7026 1938-1891 |
language | eng |
recordid | cdi_ieee_primary_4227631 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Annealing Bonding Degradation Flash memory Hydrogen Nitrogen Oxidation Research and development Thermal stresses Threshold voltage |
title | Development and Optimization of Re-Oxidized Tunnel Oxide with Nitrogen Incorporation for the Flash Memory Applications |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T12%3A53%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Development%20and%20Optimization%20of%20Re-Oxidized%20Tunnel%20Oxide%20with%20Nitrogen%20Incorporation%20for%20the%20Flash%20Memory%20Applications&rft.btitle=2007%20IEEE%20International%20Reliability%20Physics%20Symposium%20Proceedings.%2045th%20Annual&rft.au=Jung-Geun%20Jee&rft.date=2007-04&rft.spage=184&rft.epage=189&rft.pages=184-189&rft.issn=1541-7026&rft.eissn=1938-1891&rft.isbn=9781424409181&rft.isbn_list=1424409187&rft_id=info:doi/10.1109/RELPHY.2007.369890&rft_dat=%3Cieee_6IE%3E4227631%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424409195&rft.eisbn_list=9781424409198&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4227631&rfr_iscdi=true |