Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on components and packaging technologies 2007-06, Vol.30 (2), p.359-359
Hauptverfasser:	Kay, Robert W., Stoyanov, Stoyan, Glinski, Greg P., Bailey, Chris, Desmulliez, Marc P. Y.
Format:	Artikel
Sprache:	eng
Schlagworte:	Assembly Biographies Costs Design optimization Microelectronics Numerical models Packaging Printing Product design Temperature
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page	359
container_issue	2
container_start_page	359
container_title	IEEE transactions on components and packaging technologies
container_volume	30
creator	Kay, Robert W. Stoyanov, Stoyan Glinski, Greg P. Bailey, Chris Desmulliez, Marc P. Y.
description
doi_str_mv	10.1109/TCAPT.2007.895649
format	Article
fullrecord	<record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_ieee_primary_4214943</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4214943</ieee_id><sourcerecordid>2337208411</sourcerecordid><originalsourceid>FETCH-LOGICAL-c898-3ba1573e54c27d1ff5263d93dc185da241d3d782cc6755cd58985e6f3945241a3</originalsourceid><addsrcrecordid>eNo9kM1OwzAQhCMEEqXwAIiL1XuKHdtJfKwi_qRKcAhny7XX1FUaB9sV6tuTNojT7mrn29FOlt0TvCQEi8e2WX20ywLjalkLXjJxkc0I51UuRFVcnvqC5JRScp3dxLjDmLCaiVk2ND4E0Mn5PqLk0eKzS0Hl1vWABpf0FsUEvXYdGoLrk-u_kPUBKdT5H6R9TEj15jwk2A8QVDoEQLZzQ663bkAqRthvuuOIew0xLm6zK6u6CHd_dZ61z09t85qv31_emtU617Woc7pRhFcUONNFZYi1vCipEdRoUnOjCkYMNVVdaF1WnGvDR4hDaalgfFwqOs8W09nR9_sAMcmdP4R-dJR1ySqGBa5HEZlEOvgYA1g5PrlX4SgJlqdY5TlWeYpVTrGOzMPEOAD417OCMMEo_QWb_nSH</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>864740908</pqid></control><display><type>article</type><title>Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"</title><source>IEEE Xplore</source><creator>Kay, Robert W. ; Stoyanov, Stoyan ; Glinski, Greg P. ; Bailey, Chris ; Desmulliez, Marc P. Y.</creator><creatorcontrib>Kay, Robert W. ; Stoyanov, Stoyan ; Glinski, Greg P. ; Bailey, Chris ; Desmulliez, Marc P. Y.</creatorcontrib><identifier>ISSN: 1521-3331</identifier><identifier>EISSN: 1557-9972</identifier><identifier>DOI: 10.1109/TCAPT.2007.895649</identifier><identifier>CODEN: ITCPFB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Assembly ; Biographies ; Costs ; Design optimization ; Microelectronics ; Numerical models ; Packaging ; Printing ; Product design ; Temperature</subject><ispartof>IEEE transactions on components and packaging technologies, 2007-06, Vol.30 (2), p.359-359</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2007</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c898-3ba1573e54c27d1ff5263d93dc185da241d3d782cc6755cd58985e6f3945241a3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4214943$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4214943$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Kay, Robert W.</creatorcontrib><creatorcontrib>Stoyanov, Stoyan</creatorcontrib><creatorcontrib>Glinski, Greg P.</creatorcontrib><creatorcontrib>Bailey, Chris</creatorcontrib><creatorcontrib>Desmulliez, Marc P. Y.</creatorcontrib><title>Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"</title><title>IEEE transactions on components and packaging technologies</title><addtitle>TCAPT</addtitle><subject>Assembly</subject><subject>Biographies</subject><subject>Costs</subject><subject>Design optimization</subject><subject>Microelectronics</subject><subject>Numerical models</subject><subject>Packaging</subject><subject>Printing</subject><subject>Product design</subject><subject>Temperature</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kM1OwzAQhCMEEqXwAIiL1XuKHdtJfKwi_qRKcAhny7XX1FUaB9sV6tuTNojT7mrn29FOlt0TvCQEi8e2WX20ywLjalkLXjJxkc0I51UuRFVcnvqC5JRScp3dxLjDmLCaiVk2ND4E0Mn5PqLk0eKzS0Hl1vWABpf0FsUEvXYdGoLrk-u_kPUBKdT5H6R9TEj15jwk2A8QVDoEQLZzQ663bkAqRthvuuOIew0xLm6zK6u6CHd_dZ61z09t85qv31_emtU617Woc7pRhFcUONNFZYi1vCipEdRoUnOjCkYMNVVdaF1WnGvDR4hDaalgfFwqOs8W09nR9_sAMcmdP4R-dJR1ySqGBa5HEZlEOvgYA1g5PrlX4SgJlqdY5TlWeYpVTrGOzMPEOAD417OCMMEo_QWb_nSH</recordid><startdate>200706</startdate><enddate>200706</enddate><creator>Kay, Robert W.</creator><creator>Stoyanov, Stoyan</creator><creator>Glinski, Greg P.</creator><creator>Bailey, Chris</creator><creator>Desmulliez, Marc P. Y.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>200706</creationdate><title>Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"</title><author>Kay, Robert W. ; Stoyanov, Stoyan ; Glinski, Greg P. ; Bailey, Chris ; Desmulliez, Marc P. Y.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c898-3ba1573e54c27d1ff5263d93dc185da241d3d782cc6755cd58985e6f3945241a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Assembly</topic><topic>Biographies</topic><topic>Costs</topic><topic>Design optimization</topic><topic>Microelectronics</topic><topic>Numerical models</topic><topic>Packaging</topic><topic>Printing</topic><topic>Product design</topic><topic>Temperature</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kay, Robert W.</creatorcontrib><creatorcontrib>Stoyanov, Stoyan</creatorcontrib><creatorcontrib>Glinski, Greg P.</creatorcontrib><creatorcontrib>Bailey, Chris</creatorcontrib><creatorcontrib>Desmulliez, Marc P. Y.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005–Present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998–Present</collection><collection>IEEE Xplore</collection><collection>CrossRef</collection><jtitle>IEEE transactions on components and packaging technologies</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kay, Robert W.</au><au>Stoyanov, Stoyan</au><au>Glinski, Greg P.</au><au>Bailey, Chris</au><au>Desmulliez, Marc P. Y.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"</atitle><jtitle>IEEE transactions on components and packaging technologies</jtitle><stitle>TCAPT</stitle><date>2007-06</date><risdate>2007</risdate><volume>30</volume><issue>2</issue><spage>359</spage><epage>359</epage><pages>359-359</pages><issn>1521-3331</issn><eissn>1557-9972</eissn><coden>ITCPFB</coden><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TCAPT.2007.895649</doi><tpages>1</tpages></addata></record>
fulltext	fulltext_linktorsrc
identifier	ISSN: 1521-3331
ispartof	IEEE transactions on components and packaging technologies, 2007-06, Vol.30 (2), p.359-359
issn	1521-3331 1557-9972
language	eng
recordid	cdi_ieee_primary_4214943
source	IEEE Xplore
subjects	Assembly Biographies Costs Design optimization Microelectronics Numerical models Packaging Printing Product design Temperature
title	Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T07%3A35%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Corrections%20to%20%22Ultra-fine%20pitch%20stencil%20printing%20for%20a%20low%20cost%20and%20low%20temperature%20flip-chip%20assembly%20process%22&rft.jtitle=IEEE%20transactions%20on%20components%20and%20packaging%20technologies&rft.au=Kay,%20Robert%20W.&rft.date=2007-06&rft.volume=30&rft.issue=2&rft.spage=359&rft.epage=359&rft.pages=359-359&rft.issn=1521-3331&rft.eissn=1557-9972&rft.coden=ITCPFB&rft_id=info:doi/10.1109/TCAPT.2007.895649&rft_dat=%3Cproquest_RIE%3E2337208411%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=864740908&rft_id=info:pmid/&rft_ieee_id=4214943&rfr_iscdi=true