A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm 2 /W from the cooler sur...

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Veröffentlicht in:IEEE transactions on components and packaging technologies 2007-06, Vol.30 (2), p.218-225
Hauptverfasser: Colgan, E.G., Furman, B., Gaynes, M., Graham, W.S., LaBianca, N.C., Magerlein, J.H., Polastre, R.J., Rothwell, M.B., Bezama, R.J., Choudhary, R., Marston, K.C., Toy, H., Wakil, J., Zitz, J.A., Schmidt, R.R.
Format: Artikel
Sprache:eng
Schlagworte:
Bonding
Chips
Coolers
Cooling
Density
Design optimization
High power density
Inlets
liquid cooling
Microchannel
microchannel cooling
Microchannels
Microprocessors
Resistance heating
Silicon
Surface resistance
Testing
Thermal resistance
Water heating
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Beschreibung
Zusammenfassung:This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm 2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2007.897977