A system-theoretic approach to modeling and analysis of deposition rate uniformity in PECVD

A system-theoretic approach to modeling and analysis of deposition rate uniformity in PECVD

This paper gives an overview of the modeling methodology being developed for the analysis of plasma-enhanced chemical vapor deposition (PECVD) processes. The following are components in our modeling effort: a comprehensive numerical simulation using the software package FLUENT, a lower order analyti...

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Hauptverfasser: Hamby, E.S., Kabamba, P.T., Meerkov, S.M.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Analytical models
Chemical analysis
Electrodes
Inductors
Numerical simulation
Plasma applications
Plasma chemistry
Plasma simulation
Plasma sources
Solid modeling
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Beschreibung
Zusammenfassung:This paper gives an overview of the modeling methodology being developed for the analysis of plasma-enhanced chemical vapor deposition (PECVD) processes. The following are components in our modeling effort: a comprehensive numerical simulation using the software package FLUENT, a lower order analytical model, and an error analysis.< >
DOI:10.1109/CDC.1994.411041