Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates

This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40 degC to 85 degC has been demonstrated in an organic laminate substrate. Stand-alon...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Ghiu, C.-D., Dalmia, S., Vickers, J., Carastro, L., Czakon, W., Sundaram, V., White, G.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Crystallization Diplexer direct current Inductors IPD Laminates Liquid crystal polymers Nonhomogeneous media organics Packaging Radio frequency Stability substrate Temperature distribution Testing thermal
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!