Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates

Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates

This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40 degC to 85 degC has been demonstrated in an organic laminate substrate. Stand-alon...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ghiu, C.-D., Dalmia, S., Vickers, J., Carastro, L., Czakon, W., Sundaram, V., White, G.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Crystallization
Diplexer
direct current
Inductors
IPD
Laminates
Liquid crystal polymers
Nonhomogeneous media
organics
Packaging
Radio frequency
Stability
substrate
Temperature distribution
Testing
thermal
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40 degC to 85 degC has been demonstrated in an organic laminate substrate. Stand-alone, high Q inductors built on a multilayered liquid crystalline polymer (LCP)-based substrate can withstand a 2A direct current with the temperatures well within the safe range. The power handling capability of surface mounted IPDs is also assessed in this study. Reliability test data demonstrated the multilayer substrate compatibility with 1times and 3times lead free solder reflow. A promising high temperature LCP material enabled a significant improvement in the stability of electrical performance after 3times reflow at 260 degC
DOI:10.1109/EUMC.2006.281486