Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)

Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)

This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive lo...

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Hauptverfasser: Keh Shin Beh, Wei Keat Loh, Jenn Seong Leong, Wooi Aim Tan
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Electronic packaging thermal management
Electronics packaging
Fatigue
Fixtures
Flip chip
Heat sinks
Soldering
Testing
Thermal loading
Thermal stresses
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creator Keh Shin Beh
Wei Keat Loh
Jenn Seong Leong
Wooi Aim Tan
description This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive load applied was found to be important factors in determining failure region across ball grid array (BGA). Lastly, board thickness effect under different heat sink configuration was also evaluated
doi_str_mv 10.1109/HDP.2005.251405
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_4017446</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>4017446</ieee_id><sourcerecordid>4017446</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-1da54d2e208d9616a2386cacaf56c9f27a2beeebfb404c51a3e19755351c0d053</originalsourceid><addsrcrecordid>eNpVTM9LwzAYjYigzJ49eMlRD61ffrXNsau2EwoO3MHbSJPURbq1JFPYf29QL3483uP94EPohkBGCMiH1eM6owAio4JwEGcokUUJEUxSyeT5P0_pJUpC-IB4XLCi4FforZ72s7chuC-Lu0kZXO_UONrDuw14OuDXzx6TDAAvY4rX7qh3eJg8bkY3x2mkn6L1zuDKe3XCd029bKv7a3QxqDHY5E8XaNM8bepV2r20z3XVpU7CMSVGCW6opVAamZNcUVbmWmk1iFzLgRaK9tbafug5cC2IYpbIQggmiAYDgi3Q7e9bF2fb2bu98qctB1JwnrNv7TNPlw</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Keh Shin Beh ; Wei Keat Loh ; Jenn Seong Leong ; Wooi Aim Tan</creator><creatorcontrib>Keh Shin Beh ; Wei Keat Loh ; Jenn Seong Leong ; Wooi Aim Tan</creatorcontrib><description>This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive load applied was found to be important factors in determining failure region across ball grid array (BGA). Lastly, board thickness effect under different heat sink configuration was also evaluated</description><identifier>ISBN: 9780780392922</identifier><identifier>ISBN: 0780392922</identifier><identifier>EISBN: 9780780392939</identifier><identifier>EISBN: 0780392930</identifier><identifier>DOI: 10.1109/HDP.2005.251405</identifier><language>eng</language><publisher>IEEE</publisher><subject>Electronic packaging thermal management ; Electronics packaging ; Fatigue ; Fixtures ; Flip chip ; Heat sinks ; Soldering ; Testing ; Thermal loading ; Thermal stresses</subject><ispartof>2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2005, p.1-5</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4017446$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/4017446$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Keh Shin Beh</creatorcontrib><creatorcontrib>Wei Keat Loh</creatorcontrib><creatorcontrib>Jenn Seong Leong</creatorcontrib><creatorcontrib>Wooi Aim Tan</creatorcontrib><title>Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)</title><title>2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis</title><addtitle>HDP</addtitle><description>This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive load applied was found to be important factors in determining failure region across ball grid array (BGA). Lastly, board thickness effect under different heat sink configuration was also evaluated</description><subject>Electronic packaging thermal management</subject><subject>Electronics packaging</subject><subject>Fatigue</subject><subject>Fixtures</subject><subject>Flip chip</subject><subject>Heat sinks</subject><subject>Soldering</subject><subject>Testing</subject><subject>Thermal loading</subject><subject>Thermal stresses</subject><isbn>9780780392922</isbn><isbn>0780392922</isbn><isbn>9780780392939</isbn><isbn>0780392930</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2005</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVTM9LwzAYjYigzJ49eMlRD61ffrXNsau2EwoO3MHbSJPURbq1JFPYf29QL3483uP94EPohkBGCMiH1eM6owAio4JwEGcokUUJEUxSyeT5P0_pJUpC-IB4XLCi4FforZ72s7chuC-Lu0kZXO_UONrDuw14OuDXzx6TDAAvY4rX7qh3eJg8bkY3x2mkn6L1zuDKe3XCd029bKv7a3QxqDHY5E8XaNM8bepV2r20z3XVpU7CMSVGCW6opVAamZNcUVbmWmk1iFzLgRaK9tbafug5cC2IYpbIQggmiAYDgi3Q7e9bF2fb2bu98qctB1JwnrNv7TNPlw</recordid><startdate>200506</startdate><enddate>200506</enddate><creator>Keh Shin Beh</creator><creator>Wei Keat Loh</creator><creator>Jenn Seong Leong</creator><creator>Wooi Aim Tan</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200506</creationdate><title>Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)</title><author>Keh Shin Beh ; Wei Keat Loh ; Jenn Seong Leong ; Wooi Aim Tan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-1da54d2e208d9616a2386cacaf56c9f27a2beeebfb404c51a3e19755351c0d053</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Electronic packaging thermal management</topic><topic>Electronics packaging</topic><topic>Fatigue</topic><topic>Fixtures</topic><topic>Flip chip</topic><topic>Heat sinks</topic><topic>Soldering</topic><topic>Testing</topic><topic>Thermal loading</topic><topic>Thermal stresses</topic><toplevel>online_resources</toplevel><creatorcontrib>Keh Shin Beh</creatorcontrib><creatorcontrib>Wei Keat Loh</creatorcontrib><creatorcontrib>Jenn Seong Leong</creatorcontrib><creatorcontrib>Wooi Aim Tan</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Keh Shin Beh</au><au>Wei Keat Loh</au><au>Jenn Seong Leong</au><au>Wooi Aim Tan</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)</atitle><btitle>2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis</btitle><stitle>HDP</stitle><date>2005-06</date><risdate>2005</risdate><spage>1</spage><epage>5</epage><pages>1-5</pages><isbn>9780780392922</isbn><isbn>0780392922</isbn><eisbn>9780780392939</eisbn><eisbn>0780392930</eisbn><abstract>This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive load applied was found to be important factors in determining failure region across ball grid array (BGA). Lastly, board thickness effect under different heat sink configuration was also evaluated</abstract><pub>IEEE</pub><doi>10.1109/HDP.2005.251405</doi><tpages>5</tpages></addata></record>
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Electronic packaging thermal management
Electronics packaging
Fatigue
Fixtures
Flip chip
Heat sinks
Soldering
Testing
Thermal loading
Thermal stresses
title Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T03%3A25%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Compressive%20Load%20Challenges%20on%20Sub%201.00%20Ball%20Pitch%20for%20Flip%20Chip%20Ball%20Grid%20Array%20(FCBGA)&rft.btitle=2005%20Conference%20on%20High%20Density%20Microsystem%20Design%20and%20Packaging%20and%20Component%20Failure%20Analysis&rft.au=Keh%20Shin%20Beh&rft.date=2005-06&rft.spage=1&rft.epage=5&rft.pages=1-5&rft.isbn=9780780392922&rft.isbn_list=0780392922&rft_id=info:doi/10.1109/HDP.2005.251405&rft_dat=%3Cieee_6IE%3E4017446%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=9780780392939&rft.eisbn_list=0780392930&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=4017446&rfr_iscdi=true