Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)

Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)

This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive lo...

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Hauptverfasser: Keh Shin Beh, Wei Keat Loh, Jenn Seong Leong, Wooi Aim Tan
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Electronic packaging thermal management
Electronics packaging
Fatigue
Fixtures
Flip chip
Heat sinks
Soldering
Testing
Thermal loading
Thermal stresses
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Zusammenfassung:This paper reviews sub 1.00mm ball pitch solder joint reliability (SJR) challenges under compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. Heat sink configuration and compressive load applied was found to be important factors in determining failure region across ball grid array (BGA). Lastly, board thickness effect under different heat sink configuration was also evaluated
DOI:10.1109/HDP.2005.251405