Plastic Packaged High Linearity Low Noise Amplifier for 12-30GHz Multi-band Telecom Applications

Plastic Packaged High Linearity Low Noise Amplifier for 12-30GHz Multi-band Telecom Applications

The packaged MMIC design and measured performance of from 12 to 30GHz are reported in this paper. A mature 0.25mum gate length low noise pseudomorphic HEMT technology has been used with a BCB-based protection allowing easy and high reliability chip integration into plastic packages. A standard plast...

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Bibliographische Detailangaben
Hauptverfasser: Byk, E., Quentin, P., Camiade, M., Tranchant, S.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Frequency measurement
Gain measurement
Linearity
LNA
Low-noise amplifiers
MMICs
Noise measurement
OIP3
Package
PHEMTs
Plastic packaging
QFN
Semiconductor device measurement
SMD
Telecommunications
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Beschreibung
Zusammenfassung:The packaged MMIC design and measured performance of from 12 to 30GHz are reported in this paper. A mature 0.25mum gate length low noise pseudomorphic HEMT technology has been used with a BCB-based protection allowing easy and high reliability chip integration into plastic packages. A standard plastic QFN SMD package has been successfully used: 25dB typical gain has been measured with less than 2.0 dB noise figure in all the frequency band from 12 to 30GHz and more than 26dBm output IP3 has been measured in the 18-26GHz frequency band
ISSN:0149-645X
DOI:10.1109/MWSYM.2006.249787