The evolution of MMIC packaging

The authors outline current evolution in MMIC (monolithic microwave integrated circuit) packaging through a series of examples of newly emerging technologies and products, the latter chosen primarily from active array radar. Using active array modules as an example, it is possible to project some future development trends. The longer-term trends include a continued emphasis on higher levels of packaging integration, increased use of batch fabrication and testing, reduced parts count, more automated and simpler assembly processes (fewer wire bonds), and more accurate, faster, and user-friendly package design and simulation tools.< >