Transfer laminate circuit process for fine pitch wiring technology
The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied a...
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| creator | Tsubomatsu, Y. Yoshidomi, Y. Ohhata, H. Yamazaki, T. Fukutomi, N. |
| description | The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied and a feasibility of making fine pitch wiring patterns is demonstrated.< > |
| doi_str_mv | 10.1109/ECTC.1994.367581 |
| format | Conference Proceeding |
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In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied and a feasibility of making fine pitch wiring patterns is demonstrated.< ></description><identifier>ISBN: 9780780309142</identifier><identifier>ISBN: 0780309146</identifier><identifier>DOI: 10.1109/ECTC.1994.367581</identifier><language>eng</language><publisher>IEEE</publisher><subject>Copper ; Dielectric substrates ; Dry etching ; Fabrication ; Geometry ; Integrated circuit interconnections ; Laminates ; Pattern formation ; Resists ; Wiring</subject><ispartof>1994 Proceedings. 44th Electronic Components and Technology Conference, 1994, p.786-790</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/367581$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/367581$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Tsubomatsu, Y.</creatorcontrib><creatorcontrib>Yoshidomi, Y.</creatorcontrib><creatorcontrib>Ohhata, H.</creatorcontrib><creatorcontrib>Yamazaki, T.</creatorcontrib><creatorcontrib>Fukutomi, N.</creatorcontrib><title>Transfer laminate circuit process for fine pitch wiring technology</title><title>1994 Proceedings. 44th Electronic Components and Technology Conference</title><addtitle>ECTC</addtitle><description>The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied and a feasibility of making fine pitch wiring patterns is demonstrated.< ></description><subject>Copper</subject><subject>Dielectric substrates</subject><subject>Dry etching</subject><subject>Fabrication</subject><subject>Geometry</subject><subject>Integrated circuit interconnections</subject><subject>Laminates</subject><subject>Pattern formation</subject><subject>Resists</subject><subject>Wiring</subject><isbn>9780780309142</isbn><isbn>0780309146</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1994</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj1FLwzAUhQMiTGbfh0_5A629SdYkj1qmDga-1Odxm9xuka4tSUX27y3Mw4Hv7XwcxjZQFgClfd7VTV2AtaqQld4auGOZ1aZcKksLSqxYltJ3uURtQRj1wF6biEPqKPIeL2HAmbgL0f2EmU9xdJQS78bIuzAQn8Lszvw3xDCc-EzuPIz9eLo-svsO-0TZP9fs623X1B_54fN9X78c8gBazPniV1r4VkjfGkT0CrQXoMg43SpTgZCtACOVgsqjtNKgsJX0rqIW0JJcs6fbbiCi4xTDBeP1eDsq_wDqtkiw</recordid><startdate>1994</startdate><enddate>1994</enddate><creator>Tsubomatsu, Y.</creator><creator>Yoshidomi, Y.</creator><creator>Ohhata, H.</creator><creator>Yamazaki, T.</creator><creator>Fukutomi, N.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1994</creationdate><title>Transfer laminate circuit process for fine pitch wiring technology</title><author>Tsubomatsu, Y. ; Yoshidomi, Y. ; Ohhata, H. ; Yamazaki, T. ; Fukutomi, N.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i172t-914472db23db8aaad417d214e8c7b486123b21834416da3938a2963dc6eb1a9e3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1994</creationdate><topic>Copper</topic><topic>Dielectric substrates</topic><topic>Dry etching</topic><topic>Fabrication</topic><topic>Geometry</topic><topic>Integrated circuit interconnections</topic><topic>Laminates</topic><topic>Pattern formation</topic><topic>Resists</topic><topic>Wiring</topic><toplevel>online_resources</toplevel><creatorcontrib>Tsubomatsu, Y.</creatorcontrib><creatorcontrib>Yoshidomi, Y.</creatorcontrib><creatorcontrib>Ohhata, H.</creatorcontrib><creatorcontrib>Yamazaki, T.</creatorcontrib><creatorcontrib>Fukutomi, N.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tsubomatsu, Y.</au><au>Yoshidomi, Y.</au><au>Ohhata, H.</au><au>Yamazaki, T.</au><au>Fukutomi, N.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Transfer laminate circuit process for fine pitch wiring technology</atitle><btitle>1994 Proceedings. 44th Electronic Components and Technology Conference</btitle><stitle>ECTC</stitle><date>1994</date><risdate>1994</risdate><spage>786</spage><epage>790</epage><pages>786-790</pages><isbn>9780780309142</isbn><isbn>0780309146</isbn><abstract>The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied and a feasibility of making fine pitch wiring patterns is demonstrated.< ></abstract><pub>IEEE</pub><doi>10.1109/ECTC.1994.367581</doi><tpages>5</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 9780780309142 |
| ispartof | 1994 Proceedings. 44th Electronic Components and Technology Conference, 1994, p.786-790 |
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| language | eng |
| recordid | cdi_ieee_primary_367581 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Copper Dielectric substrates Dry etching Fabrication Geometry Integrated circuit interconnections Laminates Pattern formation Resists Wiring |
| title | Transfer laminate circuit process for fine pitch wiring technology |
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